Geometrical streamline flow guiding and heat dissipating structure

ABSTRACT

A geometrical streamline flow guiding and heat-dissipating structure is formed by a heat-transferring seat, a heat-dissipating device and a fan. The heat-transferring seat has at least one heat conductive surface for being connected to the heat source. The heat-transferring seat further has at least one heat-transferring seat for heat dissipation with the radiating surface. The radiating surface has a three dimensional form, i.e. one side of the radiating surface is higher than another side thereof so as to be beneficial to guide the airflow. The heat-transferring&#39;seat is covered with the heat-dissipating device having a shape matching with the bottom thereof. The heat-transferring seat is formed by many pieces or is formed by a continuous folded structure, or is formed integrally through die casting, forging or slitting. The heat-dissipating device is buckled to the heat source through a buckle; the heat-dissipating device is connected to the fan. The fan serves to guide air into the heat-dissipating device; by the guiding of the heat-dissipating device and the radiating surface of the heat-transferring seat, air flows along streamline paths.

FIELD OF THE INVENTION

[0001] The present invention relates to a geometrical streamline flowguiding and heat-dissipating structure and especially to a threedimensional airflow guide structure.

BACKGROUND OF THE INVENTION

[0002] Microelectronic devices, especially chips used in microprocessor.are used widely, while those with higher operation speed need a betterheat-dissipating ability. Since in general, a chip must be switched overone million times in one second, therefore, large heat is generated inthe packaging layer. Therefore, all the central processing unit (CPU) ina computer has a heat-dissipating device for exhausting heat. When a newcenter processing unit is developed, a preferred heat-dissipating devicerequired so as to assist the CPU to dissipate heat. Therefore, it isapparent that heat-dissipating device is necessary.

[0003] In the prior art way for resolving the problem of heatdissipation only radiating block is used or only fan is used, butafterwards, a combination structure is developed. At first, a radiatingblock is in contact with the surface of a chip and then a fan isconnected to the lateral side or upper side of the radiating block, andthus a top blowing or lateral blowing heat dissipation structure isformed. This is a main trend in the current heat-dissipating device. Byusing these two components, there are many heat-dissipating devices aredisclosed. Referring to FIG. 1, a prior art spiral heat guide isillustrated. The guide has a rectangular structure and is matched to thesize of a CPU. The bottom of the guide is connected to the CPU. The heatfrom the CPU is exhausted from the guide. The most original structure isradiating sheets formed by folding an aluminum sheet. The fins are usedfor dissipating heat. Afterwards, fan is installed in the guide. The fanserves to guide air for further exhausting heat. Such a structure issuitably used to a personal computer, but not suitable to a notebookcomputer. In order to reduce the thickness, an embedded type fan shownin FIG. 1 is illustrated, which is matched with cambered wind guide atthe periphery. The defect is that the air flow will be interruptedbetween the guiding strips, and noise is generated so as to reduce theheat dissipation, Moreover, a further defect is the axial fan must guidecool air from an upper side. When the cool air flows downwards, it willimpact the contact surface between the guide and the fan. Aninterruption occurs between air flow and blades of the fan so as tointerfere the smoothness of the air flow and the effect in use isreduced. Namely, the prior art guide structure is a plane structure.Since it forms a vertical guide and is not a perfect structure, theeffect of air exhaustion can be seen from FIG. 1. It provides an initialresolving way to dissipate heat. However, the prior art guide structuredoes not serve for requirement of resolving the problems of turbulentflow and noise, and thus, a novel design is required to solve the heatdissipation in novel electronic device.

SUMMARY OF THE INVENTION

[0004] Accordingly, the primary object of the present invention is toprovide a geometrical streamline flow guiding and heat-dissipatingstructure for resolving the problem in the prior art, wherein the airflows in the radiating fins through a right angle flow path so as togenerate the interruption of airflow. The present invention provides ageometrical streamline heat-transferring seat. The difference ofelevation in the heat-transferring seat induces a potential differenceso that air flows along the radiating surface of streamline without anyright angle flow path. Air above the heat-dissipating device is firstlydrawn by the fan and then flows downwards through a right angle flowpath. While as the air blows to the radiating surface of theheat-transferring seat, it will flow along streamlines without any rightangle path so that air is exhausted outwards. Therefore, the dead pointsin the flow path of the prior art can be avoided and thus, theinterruption in the dead point is removed. Thus, air flows moresuccessfully with a shorter flow path and the exhausting speed isquicker. The present invention is a useful flow guide structure. Theturbulent flow due to the radiating strips in the prior art will notoccur. Furthermore, by further guide of the radiating sheets, air isguided naturally Therefore, the present invention provides a verypractical structure for guiding air. The guide structure of the presentinvention has a larger upper portion and a small lower portion. The heatnearest the bottom can be exhausted greatly so as to generate apreferred heat dissipation effect. Besides, in the present invention,the heat-transferring seat is well designed so that the heat in the heatsource can be exhausted easily.

[0005] In order to achieve the aforesaid object, the present inventionprovides a geometrical streamline flow guiding and heat-dissipatingstructure which is formed by a heat-transferring seat, aheat-dissipating device and a fan. The heat-transferring seat has atleast one heat conductive surface for being connected to the heatsource. The heat-transferring seat further has at least oneheat-transferring seat for heat dissipation with the radiating surface.The radiating surface has a three dimensional form, i.e. one side of theradiating surface is higher than another side thereof so as to bebeneficial to guide the airflow. The heat-transferring seat is coveredwith the heat-dissipating device having a shape matching with the bottomthereof. The heat-transferring seat is formed by many pieces or isformed by a continuous folded structure, or is formed integrally throughdie casting, forging or slitting. The heat-dissipating device is buckledto the heat source through the buckle; the heat-dissipating device isconnected to the fan. The fan serves to guide air into theheat-dissipating device. By the guiding of the heat-dissipating deviceand the radiating surface of the heat-transferring seat, air flows alongstreamlines.

[0006] The various objects and advantages of the present invention willbe more readily understood from the following detailed description whenread in conjunction with the appended drawing.

BRIEF DESCRIPTION OF THE DRAWINGS

[0007]FIG. 1 is a perspective view of a prior art design.

[0008]FIG. 2 is an exploded perspective view of the first embodiment inthe present invention.

[0009]FIG. 3 is a front view of the first embodiment in the presentinvention.

[0010]FIG. 4 shows a left side view of the first embodiment in thepresent invention.

[0011]FIG. 5 shows a right side view of the first embodiment accordingto the present invention.

[0012]FIG. 6 is an upper view of the first embodiment in the presentinvention.

[0013]FIG. 7 is an exploded perspective view of the second embodiment inthe present invention.

[0014]FIG. 8 shows a front view of the third embodiment in the presentinvention.

[0015]FIG. 9 is a front view of the fourth embodiment in the presentinvention.

[0016]FIG. 10 is a front view of the fifth embodiment of the presentinvention.

[0017]FIG. 11 is a front view of the sixth embodiment of the presentinvention.

[0018]FIG. 12 is a front view of the seventh embodiment of the presentinvention.

[0019]FIG. 13 is a front view of the eighth embodiment of the presentinvention.

[0020]FIG. 14 is an upper view of the eighth embodiment of the presentinvention.

[0021]FIG. 15 is a front view of the ninth embodiment of the presentinvention.

[0022]FIG. 16 is an upper view of the ninth embodiment of the presentinvention.

[0023]FIG. 17 is a right view of the ninth embodiment of the presentinvention.

[0024]FIG. 18 is a perspective view of the tenth embodiment in thepresent invention.

[0025]FIG. 19 is a front view of the eleventh embodiment in the presentinvention.

[0026]FIG. 20 is a right side view of the eleventh embodiment in thepresent invention.

[0027]FIG. 21 is a front view of the twelfth embodiment of the presentinvention.

[0028]FIG. 22 is an upper view of the twelfth embodiment of the presentinvention.

[0029]FIG. 23 is a right side view of the twelfth embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] Referring to FIGS. 2 to 23, the geometrical streamline flowguiding and heat-dissipating structure of the present invention isillustrated. The heat-dissipating structure installed aheat-transferring seat 1, a heat-dissipating device 6 and a fan 7. Theheat-transferring seat 1 has at least one heat conductive surface 11 anda heat source 2. In general, the heat source 2 is an electronic element,for example, a central processing unit CPU. The heat-transferring seat 1further has at least one radiating surface 12. The radiating surface 12serves to radiate heat and to guide airflow to be exhausted. Theradiating surface 12 is a three dimensional structure including one ofthe tilt surface, cambered surface, tapered surface or a curved surface.Namely, one side of the radiating surface 12 is high, while other sideis low. This design is beneficial to guide airflow. Theheat-transferring seat 1 is covered with a heat-dissipating device 6having a shape matching with that of the heat-transferring seat 1. Theheat-dissipating device 6 is formed by a plurality of radiating pieces(as shown in the figures) or formed by a folding sheet. Theheat-dissipating device 6 can be formed integrally. Therefore, theheat-transferring seat 1 and the heat-dissipating device can be formedintegrally and made by die casting, forging, slitting, etc. theheat-dissipating device 6 is buckled to the heat source 2 through abuckle 8. The top of the heat-dissipating device 6 is a plane for beingconnected to the fan 7. The fan 7 serves to guide air into the.heat-dissipating device 6. By the guiding of the heat-dissipating device6 and the radiating surface 12 of the heat-transferring seat, air flowsalong streamlines. The heat-transferring seat is a solid body or ahollow body. If it is a hollow body, it may be a heat pipe or isinserted by heat pipes. Supports can be installed in the hollowheat-transferring seat 1.

[0031] The first embodiment of the present invention is illustrated inFIGS. 2 to 6, a heat-transferring seat 1 of a triangular cylinder isillustrated, which is in contact with a heat source 2. The radiatingsurfaces 12 at two sides of the heat-transferring seat 1 of triangularcylinder are cambered surfaces. The bottom thereof is a radiatingsurface 11 to be in contact with the heat source 2. Theheat-transferring seat 1 is a hollow body. The interior thereof isinstalled with ribs 15 as supports to enhance the structure, i.e. theribs are used as supporting posts. Meanwhile, the radiating surface 11at the bottom has a plurality of grooves 14. The interior of theheat-transferring seat 1 contains with liquid 16, namely, it is formedwith a heat pipe. The heat-dissipating device 6 is formed as fins. Thatis, the lower half of the heat-dissipating device 6 is formed with aconvex cambered portion matching to a concave cambered portion of theradiating surface 12. Similarly, the buckle 8 has a shape matching tothe heat-transferring seat 1. Two lateral sides of the heat-dissipatingdevice 6 are installed with a concave portion 61 for matching to thebuckling point 71 at an edge of a fixing mask 70 of the fan 7. Namely,the buckling point 71 is buckled to the concave portion 61 so that thefixing mask 70 of the fan 7 is buckled to the top of theheat-dissipating device 6. In order to be more steadily connected to thefan, the top of the heat-dissipating device 6 is slightly higher thanthe top end of the heat-transferring seat 1 and is flat for bearing thefan 7. FIG. 3 shows that the radiating surface 11 of theheat-transferring seat 1 which guides the heat from the heat sourcealong the direction indicated by the arrow and then is exhausted alongthe direction indicated by the arrow through the radiating surface 12.Meanwhile, the fan 7 draws air in the upper side toward theheat-dissipating device 6 as that illustrated by the arrow, and then airflows along the radiating surface 12 and then along the streamline flow.path of each radiating piece. Since in the aforesaid embodiment, theheat-dissipating device 6 is separated with the heat-transferring seat1, while in the second embodiment, fins 17 can be directly formedintegrally on the surface of the heat-transferring seat 1 fordissipating heat and guiding air. The form of the fins are similar tothat illustrated in the aforesaid embodiment.

[0032] FIGS. 8 to 12 illustrate the third to seventh embodiments of thepresent invention. These embodiments have similar constructions exceptthat the structures of the heat-transferring seats are different. InFIG. 8, the heat-transferring seat 1 is a hollow body, and appearance isa triangular cylinder. Liquid contains in the heat-transferring seat 1so as to be retained as a heat pipe. The bottom of the heat-transferringseat is connected to a radiating block 3. The heat-transferring seat isconnected to the heat source through the radiating block. Theheat-transferring seat 1 in FIG. 9 is similar to that in the FIG. 8.except liquid 16 is contained between an inner layer and an outer layer.Between the inner layer and the outer layer is hollowed.

[0033] The exception in FIG. 10 is that a heat pipe 9 is placed upon astepped radiating block 30. That is, the heat-transferring seat 1 islike a round tube, moreover, the seat 31 of the stepped radiating block31 locating the heat pipe 9 is a compound type. The embodiment shown inFIG. 11 is similar to that in FIG. 10, a compound type heat-transferringseat is illustrated herein. A triangular radiating block 32 is formed asa main body of the heat-transferring seat 1 and a heat pipe 9 passesthrough a cambered seat 33. The embodiment illustrated in FIG. 12 is.similar to that illustrated in FIG. 10, a triangular concave camberedradiating block 34 is formed, and a groove seat 35 is installed thereinfor being placed with a flat heat pipe 90. From the aforesaid fiveembodiments of the heat-transferring seat 1, it is appreciated that theheat-transferring seat I can be a compound type.

[0034] The eighth embodiment illustrated in FIGS. 13 and 14 illustratesa heat-transferring seat 1 identical to that illustrated in firstembodiment except that a spiral heat-dissipating device 60 is installed,which is different from the fins in first embodiment. The air flow mayflow forwards, backwards, leftwards or rearwards. The fan 7 is embeddedin the spiral heat-dissipating device 60 for forming a larger heatradiating area. The three lateral views of the ninth embodiment of thepresent invention are illustrated in FIGS. 15 to 17. This embodiment issimilar to the eighth embodiment, only the retaining orientation of thebuckle 8 is different from that in eighth embodiment. The tenthembodiment is illustrated in FIG. 18 which has a perspective viewsimilar to that shown in ninth embodiment. However, the tenth embodimenthas an integral formed heat-transferring seat 1, which is similar to thesecond embodiment but with spiral fins 17.

[0035] The eleventh embodiment of the present invention is illustratedFIGS. 19 and 20, a heat-transferring seat 10 with a right triangularwith concave cambered surfaces is shown. Namely, the first embodimentshows a structure with two concave cambered surfaces, while in theeleventh embodiment, a structure with one concave cambered surface isshown. The heat-dissipating device 62 in eleventh embodiment are. formedwith fins. The upper side of the heat-dissipating device 62 has a fan 7.The heat-dissipating device 6 is fixed by a buckle 80 so that airflow isguided unidirectionally. Therefore, it is appreciated that theheat-dissipating device may be formed by one of the straight type, aspiral type, and a helical type. The heat-dissipating device is made byfolding a radiating sheet to be formed as radiating pieces. Since thefan is installed with notches to be beneficial for airflow. Theheat-dissipating device may be formed by a single radiating fin. Eachfin can be formed with pits for assembly and use. Moreover, theheat-dissipating device may be combined with the heat-transferring seatby one of known ways.

[0036] Three views of the twelfth embodiment are illustrated in FIGS. 21to 23. It is shown that the structure in this embodiment is similar tothat in ninth embodiment except that the width is narrower and a lateralbuckle 81 buckled from two sides is installed.

[0037] The radiating surface 12 may be one of tilt surfaces, camberedsurfaces, tapered surfaces or curved surfaces, or the combinationthereof. In the aforesaid embodiment, the heat-transferring seats 1 area hollow body and mainly have a form of heat pipe. However, the presentinvention is not confined to the aforesaid embodiments. Since theheat-transferring seat 1 has a hollow body and has a plurality of ribsas support. Other than to support the inner space of theheat-transferring seat 1, the ribs have the advantage of heat transferin the inner space. When the heat-transferring seat is a heat pipe, theribs can be used independently or are communicated with one another. Allthese designs are beneficial to the heat transfer in the interior of theheat pipe. Furthermore, forming the heat-transferring seat as a heatpipe has the advantage of reducing cost. The heat-transferring seat is ahollow body with enhancing ribs, and further, it has a structure of heatpipe with a preferred heat conductivity. The hollow inner space in theheat-transferring seat may reduce the weight, and the volume thereof canbe made larger or smaller as desired. It may be well matched with theheat source so as to be formed with a strong support. Therefore, theheat-transferring seat having a form of heat pipe is hard to deform dueto outer pressure or inner vacuum. Moreover, contact thermal resistanceis decreased. Furthermore, because of the enhancing structure, thethickness of the housing of the heat-transferring seat is thinner, thisfurther reduces the conductive heat resistance. Therefore, the wholeeffect is improved.

[0038] In summary, by the tilt surface, camber surface and curvedsurface of the present invention, a cubic structure different from theprior art. design is formed, i.e., a three-dimensional guide is formed.The wind flows along single surface, double surface and all surfaces ofthe heat-transferring seat. Moreover, the flow resistance is small. Anairflow from upper side forms a direct guide along the radiating surface12 of the present invention. It is different from the prior art in whichair flows along a rectangular angle. Therefore, no dead point exists inusing. A good use is provided. Air flows more successfully and the flowpath is shorter. The speed for exhausting air is quicker. Therefore, thenoise from the flow is small, air flows quickly with a rapid heatdissipation and thus, the heat dissipates with a preferred efficiency.No tail flow or turbulent flow generates. The overall heat transferefficiency is better than that in the prior art. Since the flowresistance is small, a heat-dissipating device with moreheat-dissipating pieces can be used and a fan driving a small wind flowcan be used, while a better efficiency than the prior art can beachieved. Air is guided naturally. Moreover, the structure of thepresent invention generates a temperature distribution matching thedistribution of temperature gradient. A guide of large flow in the upperside and small flow in the lower side is formed so that the heat nearthe lower end can be exhausted greatly. Thus, the present inventionprovides a good heat transfer path so as to induce a betterheat-dissipating effect.

[0039] Although the present invention has been described with referenceto the preferred embodiments, it will be understood that the inventionis not limited to the details described thereof. Various substitutionsand modifications have been suggested in the foregoing description, and.others will occur to those of ordinary skill in the art. Therefore, allsuch substitutions and modifications are intended to be embraced withinthe scope of the invention as defined in the appended claims.

What is claimed is:
 1. A geometrical streamline flow guiding andheat-dissipating structure formed by a heat-transferring seat, aheat-dissipating device and a fan, wherein the heat-transferring seathas at least one heat conductive surface for being connected to the heatsource, the heat-transferring seat further has at least one radiatingsurface for heat dissipation; the radiating surface has a threedimensional form, i.e. one side of the radiating surface is higher thananother side thereof so as to be beneficial to guide the airflow; theheat-transferring seat is covered with the heat-dissipating devicehaving a shape matching with a bottom thereof; the heat-dissipatingdevice is buckled to the heat source through a buckle; theheat-dissipating device is connected to the fan; the fan serves to guideair into the heat-dissipating device, by guiding of the heat-dissipatingdevice and the radiating surface of the heat-transferring seat, airflows along streamline paths.
 2. The geometrical streamline flow guidingand heat-dissipating structure as claimed in claim 1, wherein theradiating surface of the heat-transferring seat is selected from one ofa group including a tilt surface, a cambered surface, a tapered surface,a curved surface and the combination thereof.
 3. The geometricalstreamline flow guiding and heat-dissipating structure as claimed inclaim 1, wherein the heat-transferring seat has a solid body.
 4. Thegeometrical streamline flow guiding and heat-dissipating structure asclaimed in claim 1, wherein the heat-transferring seat is a hollow body.5. The geometrical streamline flow guiding and heat-dissipatingstructure as claimed in claim 1, wherein the heat-transferring seat is ahollow body, and at least one heat pipe is inserted thereinto.
 6. Thegeometrical streamline flow guiding and heat-dissipating structure asclaimed in claim 1, wherein the heat-transferring seat is a hollow bodyand at least one support is installed therein.
 7. The geometricalstreamline flow guiding and heat-dissipating structure as claimed inclaim 1, wherein the heat-transferring seat is a hollow body and liquidis contained in a hollow portion.
 8. The geometrical streamline flowguiding and heat-dissipating structure as claimed in claim 7, whereinthe heat-transferring seat is a heat pipe.
 9. The geometrical streamlineflow guiding and heat-dissipating structure as claimed in claim 1,wherein the heat-transferring seat is formed by at least one radiatingblock and at least one heat pipe, the radiating block is formed withheat conductive surfaces, and radiating surfaces are formed on theradiating block or a surface of the heat pipe.
 10. The geometricalstreamline flow guiding and heat-dissipating structure as claimed inclaim 1, wherein the guiding and radiating strips have a shape selectedfrom one of a group including a straight shape, a spiral shape and ahelical shape.
 11. The geometrical streamline flow guiding andheat-dissipating structure as claimed in claim 1, wherein theheat-transferring seat is formed by many pieces or is formed by acontinuous folded structure.
 12. The geometrical streamline flow guidingand heat-dissipating structure as claimed in claim 1, wherein the fan isinstalled on the heat-dissipating device through a fixing mask.
 13. Thegeometrical streamline flow guiding and heat-dissipating structure asclaimed in claim 1, wherein the fan is embedded into theheat-dissipating device.
 14. The geometrical streamline flow guiding andheat-dissipating structure as claimed in claim 1, wherein theheat-dissipating device is integrally formed with the heat-transferringseat.
 15. The geometrical streamline flow guiding and heat-dissipatingstructure as claimed in claim 1, wherein the heat-transferring seat isformed integrally, which is formed by one way selecting from one of agroup of die casting, forging, and slitting.
 16. The geometricalstreamline flow guiding and heat-dissipating structure as claimed inclaim 1, wherein the heat-dissipating device is formed integrally, whichis formed by one way selecting from one of a group of die casting,forging, and slitting.